Ceva scores major Bluetooth HDT design win with integrated RF tech, boosting its wireless solutions strategy.

Ceva, a leading licensor of silicon and software IP, announced a significant design win with a top U.S. semiconductor company adopting its Bluetooth High Data Throughput (HDT) platform, which integrates digital baseband, software stack, and Ceva's own RF technology. This milestone validates Ceva's shift from component IP to full-stack wireless solutions, offering customers reduced integration complexity and faster time-to-market. The win positions Ceva strongly in the growing Bluetooth 6.0 market and the next wave of high-performance wireless devices, expanding its addressable market and deepening customer partnerships across multiple product generations.