The expansion of high-bandwidth memory (HBM) manufacturing is fueling significant investment growth in semiconductor equipment, spanning wafer fabrication to advanced packaging. Companies like TOWA and Wonik IPS report order and revenue surges, highlighting rising demand for complex manufacturing processes including etching, bonding, and inspection. Major U.S. firms such as Lam Research, KLA, Applied Materials, and Camtek benefit from this trend, with Applied Materials increasing its stake in BESI to gain exposure to next-gen hybrid bonding technology. While the growth outlook is strong, risks remain if memory supply outpaces demand, potentially moderating future equipment spending.
Lam Research trades at USD 224.01, up 1.22% as of Nov 10, 2026 22:43 WIB on Pluang, showing strong investor interest. Applied Materials is priced at USD 374.66, rising 1.11%, reflecting confidence in its expanded role in hybrid bonding technology. KLA Corp also gained 0.71% to USD 152.45, despite a majority sell order activity on Pluang, indicating mixed sentiment in semiconductor equipment stocks.
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Applied Materials stock rose 11% ahead of its Q4 FY2026 earnings report, driven by strong demand in wafer fabrication equipment linked to AI growth. The company expects significant revenue and earnings growth for 2026, supported by advances in DRAM a...
Lam Research announced a $25 billion share buyback authorization, boosting its stock by over 7% after a recent sharp selloff in semiconductor shares. This move is significant for investors in semiconductor, tech, and Nasdaq-100 ETFs, as Lam is a majo...
