GlobalFoundries partners with TSMC to build US silicon interposer supply for AI chip packaging, $2B deal.

GlobalFoundries has signed a $2 billion multi-year agreement with TSMC to manufacture silicon interposers at its Malta, New York facility. This partnership aims to establish the first U.S.-based supply of advanced packaging components critical for AI and high-performance computing chips. Production is expected to ramp up in the first half of 2028, supporting growing demand and strengthening the semiconductor supply chain. The deal includes potential capacity expansions over five years to meet future needs.

GlobalFoundries Inc. shares are trading at USD 50.02, up 4.06% as of Oct 08, 2026 19:22 WIB on Pluang. The company’s market cap stands at $26.80 billion, reflecting strong investor interest possibly linked to its new $2 billion agreement with TSMC to supply silicon interposers for AI chip packaging. This deal highlights GlobalFoundries’ strategic role in the semiconductor sector, supporting advanced technology growth and supply chain resilience.