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TSMC and Samsung commit to ASML's $400M High NA EUV machines for advanced chip production by 2030.

Market News
08 Sep 2026
CNBC
View Source
Bullish
TSMC and Samsung commit to ASML's $400M High NA EUV machines for advanced chip production by 2030.

TSMC and Samsung, two leading chipmakers, have committed to using ASML's High NA EUV lithography machines, which cost around $400 million each, to produce more advanced chips. Samsung plans to adopt this technology for DRAM memory manufacturing starting in 2028, while TSMC expects to use it for advanced chips by 2030, driven by AI chip demands. This adoption is seen as crucial for ASML's growth, as the High NA machines enable printing smaller, more intricate circuit patterns. Both companies will also collaborate with ASML on next-generation photomask technology to improve chipmaking efficiency and reduce costs.

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