Kulicke & Soffa Industries is enhancing AI infrastructure by advancing its Thermo-Compression Bonding (TCB) solutions, which support emerging Co-Packaged Optics (CPO) applications. These technologies improve data transfer speeds and energy efficiency in data centers by enabling higher-density assembly in semiconductor packages. The company's Fluxless Thermo-Compression solution leads the market with flexible options that boost interconnect quality and bandwidth, supporting next-generation AI, cloud computing, and networking needs. Kulicke & Soffa will showcase these innovations at SEMICON Taiwan 2026, highlighting its role in the AI-driven semiconductor transformation.
Ipsos has appointed Mitch Barns as Chairman and CEO for the Americas region, effective November 2, 2026. Barns brings extensive leadership experience from his previous roles as Global CEO of Nielsen and CEO of The Opus Group, positioning him to drive...
SAP, a global enterprise software leader, will merge its North Texas operations into a new office in Addison, Texas, relocating about 1,000 employees from Plano and Allen. The new Spectrum Center location will house business operations, software deve...
The global Industrial Control System (ICS) Security Market is projected to grow from $17.91 billion in 2026 to $38.48 billion by 2031, at a CAGR of 16.5%. This growth is driven by rising cyberattacks targeting critical infrastructure and the increasi...
The inaugural SportsTech Breakthrough Awards recognized leading companies and technologies advancing sports technology globally. Winners span categories like athlete performance, wearables, AI analytics, fan engagement, and smart stadium solutions, h...
AdvantageLumber.com has introduced Sketch-A-Deck, a free online software that simplifies deck design for homeowners and contractors. The tool allows users to draw custom deck layouts, attach them to their homes, and generate build-ready plans with de...
