GlobalFoundries announced a $2 billion multiyear agreement with TSMC to expand production of advanced packaging components at its Malta, New York facility. This deal will establish the first US source for silicon interposers used in TSMC's CoWoS technology, critical for AI and high-performance computing. Production is expected to ramp up in the first half of 2028, with the agreement lasting five years. The expansion enhances GlobalFoundries' role in the US AI chip supply chain and supports growing demand for advanced packaging technology.
GlobalFoundries shares rose 4.54% to USD 50.25 as of Oct 08, 2026 22:21 WIB, still well below their 52-week high of USD 89.96 but above the 52-week low of USD 32.24. This price movement contrasts with the stock's broader range, highlighting renewed investor interest following the $2 billion deal with TSMC. The company's market cap stands at $26.80 billion, reflecting its significant role in the technology sector.
