Applied Materials to acquire NEXX, expanding AI chip packaging tech portfolio.

Applied Materials has agreed to acquire NEXX from ASMPT Limited, a supplier of advanced packaging deposition equipment for semiconductors. This acquisition will enhance Applied Materials' panel-level packaging technologies, enabling chipmakers to build larger, more energy-efficient AI accelerators. The deal is expected to close in the coming months without regulatory hurdles, with the NEXX team joining Applied's Semiconductor Products Group in Massachusetts. Financial terms were not disclosed, but the move strengthens Applied Materials' position in the growing AI chip market.