Applied Materials expands advanced packaging with acquisition of NEXX from ASMPT.

Applied Materials has agreed to acquire NEXX, a business unit of ASMPT, to enhance its portfolio in advanced semiconductor packaging. NEXX specializes in large-area panel-level deposition equipment, crucial for building larger, energy-efficient AI chips with complex architectures. This acquisition will allow Applied Materials to offer more comprehensive solutions for advanced packaging technologies, supporting the growing demand for AI accelerators. The deal is expected to close in the coming months, with NEXX's team joining Applied's Semiconductor Products Group in Massachusetts.