Applied Materials has agreed to acquire NEXX, a business unit of ASMPT, to enhance its portfolio in advanced semiconductor packaging. NEXX specializes in large-area panel-level deposition equipment, crucial for building larger, energy-efficient AI chips with complex architectures. This acquisition will allow Applied Materials to offer more comprehensive solutions for advanced packaging technologies, supporting the growing demand for AI accelerators. The deal is expected to close in the coming months, with NEXX's team joining Applied's Semiconductor Products Group in Massachusetts.
Applied Materials introduced two advanced semiconductor manufacturing systems: Centris™ Spectral™ SiN ALD for uniform silicon nitride deposition and Producer™ Selectra™ Mo Etch for precise molybdenum removal in 3D chip structures. These innovations a...
Applied Materials shares jumped 25.22% in one week after a tough June, driven by strong AI-related demand and raised growth forecasts. Despite record revenue and earnings guidance, the stock trades at high valuations and faces risks like declining fr...
Following SpaceX's historic $75 billion IPO, Lynx Equity suggests Nvidia could be the biggest winner due to increased demand for AI infrastructure. SpaceX's valuation is closely linked to Elon Musk's AI venture xAI, which relies heavily on Nvidia GPU...
