Applied Materials has agreed to acquire NEXX, a business unit of ASMPT, to enhance its portfolio in advanced semiconductor packaging. NEXX specializes in large-area panel-level deposition equipment, crucial for building larger, energy-efficient AI chips with complex architectures. This acquisition will allow Applied Materials to offer more comprehensive solutions for advanced packaging technologies, supporting the growing demand for AI accelerators. The deal is expected to close in the coming months, with NEXX's team joining Applied's Semiconductor Products Group in Massachusetts.
Applied Materials has partnered with SCREEN Semiconductor Solutions to integrate advanced wafer cleaning technologies at Applied's new EPIC Center in Silicon Valley. This collaboration aims to develop co-optimized process solutions that improve yield...
This week, investors focus on key inflation data with Thursday's core PCE price index report, the Fed's preferred inflation gauge, expected at 3.3%, influencing rate decisions under new Fed Chair Kevin Warsh. A series of Federal Reserve speeches will...
