ACM Research has shipped its first 310×310 mm Ultra ECP ap-p panel-level horizontal electroplating production system to a customer in Asia outside mainland China. This milestone highlights ACM's advancement in panel-level electroplating technology, crucial for semiconductor advanced packaging, especially as AI drives demand for complex packaging. The tool supports multiple plating processes and features proprietary technology for improved plating uniformity and efficiency. ACM aims to expand its global presence and support semiconductor innovation through ongoing product development and customer collaboration.
ACM Research's stock shows strong momentum with a 3.91% gain on Pluang, trading at USD 54.00. This reflects growing investor interest in the company's semiconductor technology advancements as of Oct 28, 2026 17:41 WIB.
