ACM Research has enhanced its Ultra C Tahoe system into a multi-process wet processing platform that supports advanced wet etch and monitor wafer reclaim applications for logic and memory chip production. The platform integrates batch and single wafer processes, improving efficiency, reducing chemical use by up to 75%, and lowering cycle times by consolidating multiple steps. This expansion has been adopted by leading semiconductor manufacturers, showcasing its scalability and environmental benefits. ACM aims to continue advancing semiconductor manufacturing with flexible, efficient, and sustainable solutions.
ACM Research has enhanced its Single-Wafer Hot Sulfuric Peroxide Mixture (SPM) system by adding a sulfuric acid recycling feature that recycles 70% of the acid used. This upgrade maintains strict particle control and has been validated across over 50...
ACM Research, a semiconductor equipment maker, will release its financial results for Q3 2026 on November 5 before the U.S. market opens. The company will hold a conference call at 8:00 a.m. Eastern Time to discuss the results. Investors can join via...
ACM Research saw its China revenue rise 15.8% in 2025, outperforming the overall semiconductor equipment market, which declined by 0.5%. The company is expanding its product range beyond wafer cleaning into electrochemical plating, furnace processing...
