Ubs Ag Etracs Silver Shares Covered Call ETN Exp 21 Apr 2033 vs Taiwan Semiconductor Mfg. Co. Ltd. — how do they compare? Ubs Ag Etracs Silver Shares Covered Call ETN Exp 21 Apr 2033 trades at $64.8 (market cap $394.18M), while Taiwan Semiconductor Mfg. Co. Ltd. trades at $453.4 (market cap $2.07T). The key difference: Taiwan Semiconductor Mfg. Co. Ltd. is far larger — about 5251.4× Ubs Ag Etracs Silver Shares Covered Call ETN Exp 21 Apr 2033's market cap, and Taiwan Semiconductor Mfg. Co. Ltd. pays a 0.89% dividend while Ubs Ag Etracs Silver Shares Covered Call ETN Exp 21 Apr 2033 pays none. Which is the better fit depends on your goals — on Pluang, investors hold Ubs Ag Etracs Silver Shares Covered Call ETN Exp 21 Apr 2033 for 63 Days and Taiwan Semiconductor Mfg. Co. Ltd. for 110 Days on average.
| SLVO | TSM | |
|---|---|---|
Market Cap | $394.18M | $2.07T |
Volume | 84,843 | 13,244,224 |
Sector | Income / Options Overlay | Technology |
52-Week High | $107.41 | $485.80 |
52-Week Low | $61.81 | $275.06 |
Typical Hold Time | 63 Days | 110 Days |
Enterprise Value | — | $1.99T |
Dividend Yield | — | 0.89% |
Signals from Pluang's Aura AI — not financial advice
SLVO is trading at $63.56, down 2.67% amid bearish technical signals. The stock recently crossed below its 50-day moving average of $73.20, indicating weakening momentum. Recent news highlights silver price declines and technical breakdowns as key drivers. Technical indicators show a bearish moving average signal with neutral oscillators, while RSI levels near 29 suggest potential oversold conditions.
The outlook remains cautious with silver market volatility and dollar strength creating headwinds. Investment opportunity exists if oversold conditions lead to reversal, but risks include continued commodity pressure and technical breakdown. The stock faces resistance at $66-$67 levels with support around $64-$65.
TSM trades at $472.20, down 2.09% today, but maintains strong technical momentum with bullish moving averages and support at $470. The company demonstrates exceptional fundamentals with 44.6% net margins and consistent earnings beats, including Q2 2026 EPS of $4.22 beating estimates by 10.8%. Revenue growth accelerated to $3.81T in 2025, up 31.6% year-over-year, driven by AI chip demand and technological leadership.
Outlook remains positive with 72% analyst buy ratings and $578.43 consensus target implying 22.5% upside. Key risks include geopolitical tensions in Taiwan and cyclical semiconductor demand. The stock presents a compelling growth opportunity given its dominant foundry position and expanding AI infrastructure investments.
Trailing returns across standard periods
What Pluang investors did over the last 30 days
Latest headlines on both assets
SLVO is an exchange-traded note issued by UBS AG that provides investors with exposure to the performance of a silver-based covered call strategy. The ETN tracks the daily return of the ISE Enhanced 100x Leveraged Silver ETN Index, which combines a long position in silver with a covered call strategy on the silver position. This strategy aims to generate current income from the option premiums, which can provide a buffer during sideways or slightly down markets for silver, but it also caps the potential gains from a significant rise in silver prices. As an ETN, it is subject to the credit risk of the issuer, UBS AG, and has an expiration date of April 21, 2033.
Read more on SLVO →Taiwan Semiconductor Manufacturing Company, or TSMC, is the world's largest dedicated chip foundry, with over 57% market share in 2021 per Gartner. TSMC was founded in 1987 as a joint venture of Philips, the government of Taiwan, and private investors. It went public as an ADR in the U.S. in 1997. TSMC's scale and high-quality technology allow the firm to generate solid operating margins, even in the highly competitive foundry business. Furthermore, the shift to the fabless business model has created tailwinds for TSMC. The foundry leader has an illustrious customer base, including Apple, AMD and Nvidia, that looks to apply cutting-edge process technologies to its semiconductor designs.
Read more on TSM →