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Microchip launches 3.3 kV SiC power modules to boost efficiency in AI data center power delivery.

Others
26 May 2026
Microchip Technology
View Source
Bullish
pluang ai news

Microchip Technology has introduced new 3.3 kV HV-D3 mSiC power modules designed to enhance solid-state transformers (SSTs) for AI hyperscale data centers. These modules integrate silicon carbide MOSFETs and Schottky diodes to improve power delivery efficiency from medium-voltage grids directly to server racks, addressing power and efficiency challenges in AI token generation. The modules support high-voltage operation with enhanced thermal performance and isolation, enabling higher power density and reduced cooling needs. Besides AI data centers, these modules are also suited for heavy-duty vehicle charging, rail transportation, motor drives, and defense power systems, with availability now in production quantities.

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