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US firms ISRL USA and AIIP to build first dedicated semiconductor subfab R&D facility for sustainable chipmaking

Market News
21 Apr 2026
GlobeNewsWire
View Source
Bullish
pluang ai news

ISRL USA and AI Infrastructure Partners (AIIP) signed an MOU to create the US's first dedicated semiconductor subfab R&D facility, aimed at advancing sustainable, high-volume chip manufacturing. The facility will provide a shared research environment replicating manufacturing conditions at a fraction of the cost of private pilot lines, enabling collaboration on sustainability challenges across the semiconductor industry. AIIP will build and own the facility, while ISRL USA will manage operations and research programs. The project targets operational readiness within 12 months of full funding and aims to support industry net-zero goals by providing a platform for pre-competitive research and technology validation.

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