Radiant Utama Interinsco Tbk. vs Indosterling Technomedia Tbk. — how do they compare? Radiant Utama Interinsco Tbk. trades at Rp212 (market cap 160.16B, 5.69M 24h volume), while Indosterling Technomedia Tbk. trades at Rp50 (market cap 62.82B). The key difference: Radiant Utama Interinsco Tbk. is far larger — about 2.5× Indosterling Technomedia Tbk.'s market cap. Which is the better fit depends on your goals.
| RUIS | TECH | |
|---|---|---|
Market Cap | 160.16B | 62.82B |
Volume | 5.69M | — |
Lot | 56.9K | — |
Turnover | 1.23B | — |
Average Price | 216.05 | — |
Value | 1.23B | — |
Indicative Equilibrium Price | 212 | — |
Indicative Equilibrium Volume | 694 | — |
Trailing returns across standard periods
Latest headlines on both assets
PT Radiant Utama Interinsco (Company) was established base on notarial deed No.41 of Mr Hadi Moentoro, dated August 22, 1984. The deed of establishment was approved by the Ministry of Justice in its decision letter No. C2-574-HT.01.01.Th.85 dated Feb 11, 1985.The Company’s articles of association has been amended several times, most recently by notarial deed No. 28 of Mr. P. Soetrisno A. Tampubolon, S.H., dated Dec 19, 2005, concerning among others, the increasing paid up capital, increase authorized share, and change in the Company’s par value.PT Radiant Utama Interinsco (Company) was established base on notarial deed No.41 of Mr Hadi Moentoro, dated August 22, 1984. The deed of establishment was approved by the Ministry of Justice in its decision letter No. C2-574-HT.01.01.Th.85 dated Feb 11, 1985.The Company’s articles of association has been amended several times, most recently by notarial deed No. 28 of Mr. P. Soetrisno A. Tampubolon, S.H., dated Dec 19, 2005, concerning among others, the increasing paid up capital, increase authorized share, and change in the Company’s par value.
Read more on RUIS →PT Indosterling Technomedia Tbk (the Company) was established based on Notarial DeedNo. 97 dated January 19, 2011 of public notary Humberg Lie,S.H., MKn, a notary in Jakarta
Read more on TECH →