ARK Fintech Innovation ETF vs ASE Technology Holding Co Ltd — how do they compare? ARK Fintech Innovation ETF trades at $42.68, while ASE Technology Holding Co Ltd trades at $39.51 (market cap $85.75B). The key difference: ASE Technology Holding Co Ltd pays a 1.08% dividend while ARK Fintech Innovation ETF pays none, and ASE Technology Holding Co Ltd is trading nearer its 52-week high, ARK Fintech Innovation ETF nearer its low. Which is the better fit depends on your goals.
| ARKF | ASX | |
|---|---|---|
Sector | Sector/Thematic | Technology |
52-Week High | $58.82 | $45.12 |
52-Week Low | $36.14 | $9.63 |
Market Cap | — | $85.75B |
Enterprise Value | — | $90.15B |
Dividend Yield | — | 1.08% |
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ASE Technology Holding (ASX) trades at $39.62, up 5.39% today, with strong technical momentum and bullish moving averages. The company reported three consecutive quarterly earnings beats, with Q2 2026 EPS of $0.29 exceeding expectations by 26%. Revenue growth accelerated to $645.39B in 2025, with net income reaching $40.02B. Recent news highlights $10.5B capital expenditure increase for AI semiconductor capacity expansion.
Outlook remains positive with 80% analyst buy ratings and projected 2026 revenue of $711.2B. Key opportunities include AI-driven demand growth and margin expansion, while risks involve high valuation multiples (P/E 47.78) and significant capital expenditure commitments. The stock shows strong institutional interest despite some position adjustments by major funds.
Trailing returns across standard periods
Latest headlines on both assets
ARKF is an actively managed ETF that invests in companies leading the way in fintech innovation. Key themes include mobile payments, digital wallets, blockchain technology, and frictionless funding platforms.
Read more on ARKF →ASE Technology Holding Co Ltd is a semiconductor assembly and testing firm. The company operates in segments: Packaging, Testing, and Electronic Manufacturing Services. Of these, packaging services contribute the most revenue. It involves packaging bare semiconductors into completed semiconductors with improved electrical and thermal characteristics. The Testing Segment includes front-end engineering testing, wafer probing, and final testing services. In the EMS segment, the company designs manufacture and sells electronic components and telecommunication equipment motherboards. The company is based in Taiwan but garners over half its sales from firms in the United States.
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