Compare iShares Core US Aggregate Bond ETF (AGG) vs Taiwan Semiconductor Mfg. Co. Ltd. (TSM) Price & Performance
Price performance
Price movement over the last 24 hours
Key statistics
Key statistics
iShares Core US Aggregate Bond ETF vs Taiwan Semiconductor Mfg. Co. Ltd. — how do they compare? iShares Core US Aggregate Bond ETF trades at $98.07, while Taiwan Semiconductor Mfg. Co. Ltd. trades at $436.11 (market cap $1.98T). The key difference: Taiwan Semiconductor Mfg. Co. Ltd. pays a 0.88% dividend while iShares Core US Aggregate Bond ETF pays none, and Taiwan Semiconductor Mfg. Co. Ltd. is trading nearer its 52-week high, iShares Core US Aggregate Bond ETF nearer its low. Which is the better fit depends on your goals.
| AGG | TSM | |
|---|---|---|
Sector | Fixed Income | Technology |
52-Week High | $101.40 | $477.57 |
52-Week Low | $97.63 | $227.33 |
Market Cap | — | $1.98T |
Enterprise Value | — | $1.90T |
Dividend Yield | — | 0.88% |
Aura AI Summary
Signals from Pluang's Aura AI — not financial advice
Aura AI Summary
Signals from Pluang's Aura AI — not financial advice
AGG trades at $98.65, up 0.04% on the day, with technical indicators showing a bearish trend from moving averages but a neutral signal from oscillators. The stock faces resistance at $99 and support at $98. Recent corporate actions include scheduled dividends for May and June 2026. Financial ratios are unavailable in the provided data, limiting fundamental analysis.
The outlook remains cautious due to the bearish technical bias and lack of current financial metrics. Key risks include market volatility and interest rate uncertainty. Investors should await updated earnings reports for a clearer fundamental picture before considering positions.
TSM trades at $432.57, down 0.37% on the day, with a bullish technical signal from moving averages and strong fundamental performance. The company reported Q1 2026 EPS of $3.49, beating expectations, and maintains robust profitability with a 46.5% net income margin. Revenue growth accelerated to $3.81 trillion in 2025, up from $2.89 trillion in 2024, driven by AI chip demand. Analyst consensus is strongly bullish with a $493.75 price target, and the stock is near its 52-week high.
Outlook remains positive given TSM's critical role in AI semiconductor manufacturing and consistent earnings beats, but risks include geopolitical tensions in Taiwan, valuation premiums, and competitive pressures from hyperscalers developing in-house chips. The stock's premium P/E of 39.27 requires sustained high growth to justify further upside.
Returns comparison
Trailing returns across standard periods
Returns comparison
Trailing returns across standard periods
Top news
Latest headlines on both assets
Top news
Latest headlines on both assets
About iShares Core US Aggregate Bond ETF
AGG tracks the Bloomberg U.S. Aggregate Bond Index, providing broad exposure to the total U.S. investment-grade bond market. It serves as a core portfolio building block by diversifying across Treasuries, government-related bonds, corporate debt, and mortgage-backed securities.
Read more on AGG →About Taiwan Semiconductor Mfg. Co. Ltd.
Taiwan Semiconductor Manufacturing Company, or TSMC, is the world's largest dedicated chip foundry, with over 57% market share in 2021 per Gartner. TSMC was founded in 1987 as a joint venture of Philips, the government of Taiwan, and private investors. It went public as an ADR in the U.S. in 1997. TSMC's scale and high-quality technology allow the firm to generate solid operating margins, even in the highly competitive foundry business. Furthermore, the shift to the fabless business model has created tailwinds for TSMC. The foundry leader has an illustrious customer base, including Apple, AMD and Nvidia, that looks to apply cutting-edge process technologies to its semiconductor designs.
Read more on TSM →
