SK hynix introduced the iHBM solution embedding integrated cooling elements (ICEs) directly within the high-bandwidth memory (HBM) package to improve heat dissipation. This innovation reduces thermal resistance by 30%, enabling stable chip operation in high-temperature, high-pressure environments critical for AI and high-performance computing. The solution leverages proven MR-MUF technology for efficient mass production and is compatible with existing system designs, aiming to enhance the performance and reliability of next-generation HBM products like HBM5. SK hynix positions this as a key step to lead in AI memory technology by addressing critical heat management challenges.
Funnel has introduced Digital Measurement, a new marketing mix modeling (MMM) software that integrates MMM, Multi-Touch Attribution (MTA), and ad platform signals into one calibrated system. This approach addresses the limitations of relying on a sin...
Zealand Pharma held an Extraordinary General Meeting on May 26, 2026, where all proposals were approved, including the election of Camilla Sylvest to the Board of Directors. The board now consists of seven shareholder-elected members and four employe...
Nvidia has been a top AI investment as demand for AI chips surged, but the next wave of IPOs from major AI customers like SpaceX, OpenAI, and Anthropic could shift investor focus. These companies, while not competitors in hardware, may compete for in...
Salazar Resources announced a new copper-gold porphyry system discovery at its 100%-owned Monja Project in southern Ecuador, featuring high-grade surface samples. This discovery comes as global copper prices hit record highs due to supply deficits, i...
Novee has introduced Agentic Fix, an enhancement to its AI penetration testing platform that automates the transition from identifying security vulnerabilities to deploying fixes. This tool generates detailed remediation guidance based on validated e...
