SK hynix introduced the iHBM solution embedding integrated cooling elements (ICEs) directly within the high-bandwidth memory (HBM) package to improve heat dissipation. This innovation reduces thermal resistance by 30%, enabling stable chip operation in high-temperature, high-pressure environments critical for AI and high-performance computing. The solution leverages proven MR-MUF technology for efficient mass production and is compatible with existing system designs, aiming to enhance the performance and reliability of next-generation HBM products like HBM5. SK hynix positions this as a key step to lead in AI memory technology by addressing critical heat management challenges.
Leading Japanese companies, startups, and research institutions are developing specialized AI models using NVIDIA Nemotron open models to address Japan's unique language, industrial, and workforce challenges. These AI applications range from enterpri...
ARCpoint Inc. announced it will likely miss the July 29, 2026 deadline to file its annual financial statements and related reports due to a lack of funds to pay auditors. The company has applied for a Management Cease Trade Order (MCTO) and awaits ap...
Western Star Resources has granted 2 million incentive stock options to its directors, officers, employees, and consultants. These options are exercisable until July 15, 2029, at a price of $0.30 per share. This move aligns with the company's goal to...
Ecopetrol, Colombia's largest energy company, will announce its financial and operating results for the second quarter of 2026 on August 3 after market close. A virtual conference will follow on August 4, featuring simultaneous Spanish and English br...
Galaxy Digital reports that large Bitcoin holders (whales) have not sold their holdings over fears of quantum computing risks. Instead, concerns about quantum threats seem to influence institutional investors who are hesitant to buy Bitcoin. Recent l...
