Intel has filed a patent for a new memory technology called cross-batch memory (XBM) designed to replace costly high bandwidth memory (HBM) used in AI chips. XBM aims to eliminate the expensive silicon interposer by using fewer, faster serial links and integrating memory fabrication later in the chip manufacturing process. This could lower costs while maintaining performance, addressing a major bottleneck in AI hardware. However, commercialization is expected only after 2030, and the technology still faces significant development challenges before it can be adopted in data centers.
The global Edge AI semiconductor market, valued at $25.36 billion in 2025, is projected to grow to $151.30 billion by 2035 with a CAGR of 19.57%. Growth is fueled by increasing use of AI processors in consumer electronics, automotive, healthcare, and...
Semiconductor stocks, including AMD, Intel, and Nvidia, are showing strong bullish momentum with prices expected to rise further. AMD aims to reach $580, supported by short-term buyers, while Intel looks poised to climb towards $140 after forming a b...
The First Trust Nasdaq Semiconductor ETF (FTXL) uses a smart beta approach focusing on quality and momentum rather than market-cap weighting. Its current overweight positions in Intel and Micron have led to recent outperformance but also increased po...
Intel's stock price has surged fivefold in the past year, driven by revived CPU demand for AI and optimism around its foundry business. However, Intel Foundry's financials tell a different story: external foundry revenue remains very small, operating...
Semiconductor stocks fell sharply this week, with major indexes dropping over 10% and wiping out $1.3 trillion in market value. The selloff was driven by fears about the sustainability of AI infrastructure spending, high valuations reminiscent of the...
