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Applied Materials partners with Broadcom to advance AI chip packaging technologies.

Market News
20 May 2026
GlobeNewsWire
View Source
Bullish
pluang ai news

Applied Materials announced a partnership with Broadcom to collaborate on research and development of advanced chip packaging technologies critical for next-generation AI systems. This collaboration will leverage Applied Materials' global innovation centers, including the new EPIC Center in Silicon Valley, to accelerate the commercialization of new packaging solutions that improve energy efficiency and performance in AI chips. The partnership aims to address the growing demand for high-performance AI infrastructure by enhancing chip interconnect density and bandwidth. The EPIC platform facilitates early access to foundational innovations, speeding up the development cycle from concept to manufacturing.

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