Applied Materials introduced new chipmaking systems that enhance DRAM performance and advanced packaging for AI chips. These innovations include an improved epitaxy system for faster, more efficient DRAM, and new CMP, deposition, and eBeam systems that improve yield and precision in 3D chip stacking and packaging. This technology addresses the growing memory demands of AI workloads and supports the production of next-generation high-bandwidth memory (HBM) and advanced logic chips. The company aims to help semiconductor manufacturers scale AI chip production with higher efficiency and yield.
REX Shares has filed for the REX AI Chipmaking ETF, targeting the booming $1.3 trillion AI infrastructure sector. The fund tracks the VettaFi AI Chipmaking Index, focusing on companies involved in wafer fabrication equipment, advanced packaging, and ...
The FTSE 100 index fell slightly, dragged down by mining stocks reacting to China's slower GDP growth of 4.3% in Q2, its weakest in three years. Despite this, oil prices remained steady amid US-Iran tensions. PayPal shares jumped over 14% following r...
