Applied Materials introduced two advanced semiconductor manufacturing systems: Centris™ Spectral™ SiN ALD for uniform silicon nitride deposition and Producer™ Selectra™ Mo Etch for precise molybdenum removal in 3D chip structures. These innovations address challenges in scaling deep and narrow 3D architectures like gate-all-around transistors and high-layer-count 3D NAND, enhancing device performance, energy efficiency, and manufacturing yield. The new technologies enable chipmakers to continue advancing AI and memory chips with better material control and are already adopted by leading manufacturers. Applied Materials showcased these systems at the 2026 IEEE VLSI Symposium, signaling their role in next-generation semiconductor innovation.
Applied Materials shares jumped 25.22% in one week after a tough June, driven by strong AI-related demand and raised growth forecasts. Despite record revenue and earnings guidance, the stock trades at high valuations and faces risks like declining fr...
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