ACM Research has shipped its first plasma-enhanced chemical vapor deposition (PECVD) silicon carbonitride (SiCN) system to a leading semiconductor manufacturer. This innovative system features a unique three-station rotating deposition design that improves film uniformity and process control, targeting advanced back-end-of-line (BEOL) and packaging applications at 55-nanometer scale and below. The technology supports tighter control of interface layers and plasma stability, critical for next-generation semiconductor devices and advanced packaging reliability. This milestone expands ACM's capabilities in semiconductor manufacturing equipment, positioning it for growth in advanced device integration markets.
ACM Research, a semiconductor equipment maker, will announce its financial results for Q2 2026 before the U.S. market opens on August 7, 2026. The company will hold a conference call at 8:00 a.m. Eastern Time to discuss the results. Investors can joi...
ACM Research, a semiconductor equipment maker, will release its financial results for Q2 2026 on August 7 before the U.S. market opens. The company will hold a conference call at 8:00 a.m. Eastern Time to discuss the results. Investors can join the c...
